By the end of the year you will find us in our new premises in the Hansa Business Park in Münster. Our new building is located closely to our old premises:
All other contact data remain the same. Due to relocation we’re only partially available from December 17 to January 11. Thank you for your understanding. We look forward to doing business with you in 2019 and further mutual projects.
26th FED Conference
Innovation for Slackers
Internet of Things Congress
At the congress “Internet of Things – From Sensor to Cloud” taking place in Munich October 25th, Jeannine Budelmann will discuss “Augmented reality glasses connected to ERP systems to optimize manual mounting of circuit boards”. As the managing director of Budelmann Elektronik (specialized in customized hard and software solutions), she is aware of difficulties during manual assembly. “Manual assembly of circuit boards is prone to mistakes on several levels. Sometimes it can be difficult to place the last component between two already mounted ones.
Small Quantities - High Price?
Mass customization is not only a trend in consumer markets but also become more relevant in business-to-business contexts. But how can manufacturers offer small quantities at attractive prices?
Key to success is the modularization of the most important components. This can mean realizing different basic functionalities with one standardized board. Utilization of cross-vendor standards can also help offering small quantities at attractive prices since single components can easily be replaced by compatible other ones.