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EMC – the invisible ghost

The development of electronics used to be relatively simple because the existing components were less integrated and complex. In earlier days, people could repair a radio themselves, but today you will not be able to do so without having completed a Master’s degree in Electrical Engineering. The rising complexity can also be seen in the testing of electromagnetic compatibility (EMC). For instance, small changes in the cable routing can be crucial for the question if a device can pass the respective test.

EMS-day 2019

On the occasion of the 17th EMS-day in Würzburg, Jeannine Budelmann gave a speech about quality management in the electronics manufacturing process on 4.7.2019. The expert reported on the results of a research project where AR-glasses were tested that were programmed to support the manual assembly of electronic systems.

If you are interested in the talk and the other topics that the lecturers of the EMS-day work and do research on in their respective companies, you will find more information on the homepage of the conference: www.ems-tag.de.

Research project NEOBIO

Scientists and developers from Budelmann Elektronik collaborate with the University of Applied Siences in Münster and the Helmholtz-Zentrum Dresden-Rossendorf in the context of a new research project. The aim of the project NEOBIO (co-funded by the Federal Ministry of Food and Agriculture) is the significant increase of the efficiency of biogas plants through the fluidic optimization of the mixing process. Thus the energy demand can be lowered while the gas output can be augmented.

Conjoint Innovation

Heterogeneous teams offer the best solutions for a given problem. This is true not only for the heads of huge internet concerns, but also for small and medium-sized companies. Newest research results show that looking at a problem from a maximum number of different perspectives leads towards innovative solutions. Consequently, the most important aspect to consider is the team composition. Read more on this issue in the latest column by Dr. Christoph Budelmann. Don’t hesitate to get in touch with us if you have any questions and suggestions!

Relocation

By the end of the year you will find us in our new premises in the Hansa Business Park in Münster. Our new building is located closely to our old premises:

Kopenhagener Str. 11, 48163 Münster

All other contact data remain the same. Due to relocation we’re only partially available from December 17 to January 11. Thank you for your understanding. We look forward to doing business with you in 2019 and further mutual projects.

26th FED Conference

During the 26th FED Conference 2018 in Bamberg managing director Jeannine Budelmann gives a speech on “Optimized manual mounting of circuit boards using data glasses - Practical experience report research project OptED”. The event hosted by the Association of Design, Circuit Boards and Electronics Manufacturing this year focusses on design and manufacturing processes for smart electronics. Key points are multifunctional circuit boards as well as three-dimensional integrated circuit packaging.

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